🚀 The New Semiconductor Playbook ⚡️📈

Classic Moore’s-Law scaling is slowing, yet AI workloads are exploding. In this short video I unpack two core insights behind the New Semiconductor Playbook:

🔹 Insight 1 – Architecture Innovation Beats Pure Shrink

Chiplets, Advanced Packaging, and domain-specific accelerators deliver up to ~2,500x improvement vs. ~2x with pure shrink (when it worked well)

🔹 Insight 2 – Materials Engineering Makes the “Impossible” Possible

Material innovation with new device architectures like Gate-All-Around (GAA), backside power delivery, and 3D DRAM will unlock the next 10,000× energy-efficient performance target by 2040 - critical for #AI growth and grid #sustainability.

👇 Watch the 2min video #MakeItMaterial

https://blossom.primal.net/d94a3b7604b756bbf79095757525c4b3063cd97a1ce7b643c3690a9ef18652e0.mp4