** Thermal Management Critical in PCB Design: Advanced Techniques Revealed

As electronic devices become increasingly compact and powerful, thermal management has emerged as a critical aspect of Printed Circuit Board (PCB) design. Excessive heat can lead to component failure, reduced lifespan, and compromised performance. Advanced techniques such as thermal vias, copper planes and heat sinks, thermal pads, heat pipes, controlled dielectric materials, and computational fluid dynamics are being employed to ensure reliable performance under high-power conditions.

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Source: https://dev.to/yoy/advanced-techniques-in-pcb-thermal-management-2h45