Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

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Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg, and Purdue University President Mung Chiang joined executives of SK hynix Inc. as the company announced plans to establish a new advanced packaging fabrication and R&D facility in Indiana. SK hynix will make an initial investment of more than $3.87 billion to establish a facility in West Lafayette that will support critical U.S. demand for semiconductors. The facility will create up to 800 new, high-wage jobs by the end of 2030 and will produce next-generation HBM chips, which are critical components of graphic processing units (GPUs) that train AI systems. SK hynix selected the West Lafayette site due to Indiana's manufacturing infrastructure, talent pool, and strong government support. The investment is expected to drive innovation and fill a critical gap in the nation's advanced packaging supply chain. SK hynix plans to collaborate with Purdue University and Ivy Tech Community College to develop training programs and cultivate a high-tech workforce. Indiana is now home to a new microelectronics campus and has attracted several semiconductor manufacturing plants in recent years, committing to invest more than $6 billion and create over 2,100 new high-skilled jobs.

#Indiana #SemiconductorPackaging #SkHynix #Investment #JobCreation

https://finance.yahoo.com/news/gov-holcomb-iedc-announce-generational-185700913.html