Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's planned biggest — floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM

https://www.tomshardware.com/tech-industry/semiconductors/intel-displays-tech-to-build-extreme-multi-chiplet-packages-12-times-the-size-of-the-largest-ai-processors-beating-tsmcs-planned-biggest-floorplan-the-size-of-a-cellphone-armed-with-hbm5-14a-compute-tiles-and-18a-sram