Kuo: Apple Delays Change Aimed at Saving Space Inside Future iPhones

Apple no longer plans to use resin-coated copper for logic boards in iPhone 17 models next year, supply chain analyst Ming-Chi Kuo said today.

Kuo said resin-coated copper failed to meet Apple's "high-quality requirements," leading to the company scrapping its plans to adopt the material for iPhone 17 models. It is unclear if Apple will revisit resin-coated copper for iPhone 18 models or later, but it appears that the material is at least a few years away from being used in iPhones.

Resin-coated copper is a thin layer of copper foil coated with a resin, such as an epoxy. The material would allow for a thinner logic board, which in turn would provide more internal space for other components and sensors in future iPhones.

would use resin-coated copper this year, but it is unclear if that plan has been delayed too.

Related Roundup: iPhone 17

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